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- 124.7 Kg Drum
- Thermal Coupling of Electrical/Electronic Devices to Heat Sinks
description
- For use in thermal coupling of electrical/electronic devices to heat sinks.
applications
- Thermal coupling of electronic devices to heat sinks
- Transistors
- Diodes
- Rectifiers
- Corona suppressant
features
- High thermal conductivity
- Low bleed at high temperature
caution
- Must be filled to the proper level with the recommended lubricant for your application before operation
| Application | Heat Sink |
| Container Type | Drum |
| Thickener Type | Zinc Oxide |
| Container Size | 124.7 kg |
| Type | Heat Sink |
| Dielectric Strength, Volts per mil | 450 |
| NSF | None |
| Evaporation Percent | 1.1% @ 390 °F |
| Temperature Range [Min] | -40 °F |
| Color | White |
| Base Oil | Silicone |
| Temperature Range [Max] | 390 °F |
| NLGI No. | 2 |
| Weight | 274.964 LB |
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